AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding

R. H. Horng, D. S. Wuu, S. C. Wei, C. Y. Tseng, M. F. Huang, K. H. Chang, P. H. Liu, K. C. Lin

Research output: Contribution to journalArticle

43 Citations (Scopus)

Abstract

An AlGaInP light-emitting diode (LED) with a Au/AuBe/SiO2/Si mirror substrate has been fabricated using wafer bonding. The bonded mirror-substrate LED is capable of emitting luminous intensity of 90 and 205 mcd under 20 and 50 mA injection, respectively. The emission wavelength was found to be independent of the injection current. This feature is attributed to the Si substrate providing a good heat sink.

Original languageEnglish
Pages (from-to)3054-3056
Number of pages3
JournalApplied Physics Letters
Volume75
Issue number20
DOIs
Publication statusPublished - 1999 Nov 15

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light emitting diodes
wafers
mirrors
injection
heat sinks
luminous intensity
wavelengths

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

Horng, R. H., Wuu, D. S., Wei, S. C., Tseng, C. Y., Huang, M. F., Chang, K. H., ... Lin, K. C. (1999). AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding. Applied Physics Letters, 75(20), 3054-3056. https://doi.org/10.1063/1.125228
Horng, R. H. ; Wuu, D. S. ; Wei, S. C. ; Tseng, C. Y. ; Huang, M. F. ; Chang, K. H. ; Liu, P. H. ; Lin, K. C. / AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding. In: Applied Physics Letters. 1999 ; Vol. 75, No. 20. pp. 3054-3056.
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Horng, RH, Wuu, DS, Wei, SC, Tseng, CY, Huang, MF, Chang, KH, Liu, PH & Lin, KC 1999, 'AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding', Applied Physics Letters, vol. 75, no. 20, pp. 3054-3056. https://doi.org/10.1063/1.125228

AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding. / Horng, R. H.; Wuu, D. S.; Wei, S. C.; Tseng, C. Y.; Huang, M. F.; Chang, K. H.; Liu, P. H.; Lin, K. C.

In: Applied Physics Letters, Vol. 75, No. 20, 15.11.1999, p. 3054-3056.

Research output: Contribution to journalArticle

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T1 - AlGaInP light-emitting diodes with mirror substrates fabricated by wafer bonding

AU - Horng, R. H.

AU - Wuu, D. S.

AU - Wei, S. C.

AU - Tseng, C. Y.

AU - Huang, M. F.

AU - Chang, K. H.

AU - Liu, P. H.

AU - Lin, K. C.

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AB - An AlGaInP light-emitting diode (LED) with a Au/AuBe/SiO2/Si mirror substrate has been fabricated using wafer bonding. The bonded mirror-substrate LED is capable of emitting luminous intensity of 90 and 205 mcd under 20 and 50 mA injection, respectively. The emission wavelength was found to be independent of the injection current. This feature is attributed to the Si substrate providing a good heat sink.

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