A study on the cellphone cover-forming process of titanium alloys using the finite element method

Dyi-Cheng Chen, Ming Ren Chen, Fung Ling Nian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In recent years, the style of 3C products demanded thin and small results due to gradual trends, though most of the industry is forming a continuous manner of stamping. However, the material thickness cannot be changed in products. This paper employs the rigid-plastic finite element (FE) DEFORM TM 3D software to investigate the plastic deformation behavior of titanium alloy (Ti-6Al-4V) workpiece for the forming processes of cellphone covers. In addition, this study utilizes the Solid Work 2010 3D graphics-rendering software for modeling, which is simulation software used to import various forming process conditions. The software analyzes the effective strain, the effective stress, critical damage value, and the die radius load distribution of the work-piece. Furthermore, this study used simulative software to analyze its forming processes for changes in grain size of the microstructure. The analytical results confirm the suitability of the current finite element software for forming processes of cellphone covers.

Original languageEnglish
Title of host publicationFrontiers of Manufacturing and Design Science II
Pages1550-1554
Number of pages5
DOIs
Publication statusPublished - 2012 Jan 1
Event2nd International Conference on Frontiers of Manufacturing and Design Science, ICFMD 2011 - Taichung, Taiwan
Duration: 2011 Dec 112011 Dec 13

Publication series

NameApplied Mechanics and Materials
Volume121-126
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

Other2nd International Conference on Frontiers of Manufacturing and Design Science, ICFMD 2011
CountryTaiwan
CityTaichung
Period11-12-1111-12-13

Fingerprint

Titanium alloys
Finite element method
Stamping
Plastic deformation
Plastics
Microstructure
Industry

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Chen, D-C., Chen, M. R., & Nian, F. L. (2012). A study on the cellphone cover-forming process of titanium alloys using the finite element method. In Frontiers of Manufacturing and Design Science II (pp. 1550-1554). (Applied Mechanics and Materials; Vol. 121-126). https://doi.org/10.4028/www.scientific.net/AMM.121-126.1550
Chen, Dyi-Cheng ; Chen, Ming Ren ; Nian, Fung Ling. / A study on the cellphone cover-forming process of titanium alloys using the finite element method. Frontiers of Manufacturing and Design Science II. 2012. pp. 1550-1554 (Applied Mechanics and Materials).
@inproceedings{9a925a733ae2460c94cd0a44002e615d,
title = "A study on the cellphone cover-forming process of titanium alloys using the finite element method",
abstract = "In recent years, the style of 3C products demanded thin and small results due to gradual trends, though most of the industry is forming a continuous manner of stamping. However, the material thickness cannot be changed in products. This paper employs the rigid-plastic finite element (FE) DEFORM TM 3D software to investigate the plastic deformation behavior of titanium alloy (Ti-6Al-4V) workpiece for the forming processes of cellphone covers. In addition, this study utilizes the Solid Work 2010 3D graphics-rendering software for modeling, which is simulation software used to import various forming process conditions. The software analyzes the effective strain, the effective stress, critical damage value, and the die radius load distribution of the work-piece. Furthermore, this study used simulative software to analyze its forming processes for changes in grain size of the microstructure. The analytical results confirm the suitability of the current finite element software for forming processes of cellphone covers.",
author = "Dyi-Cheng Chen and Chen, {Ming Ren} and Nian, {Fung Ling}",
year = "2012",
month = "1",
day = "1",
doi = "10.4028/www.scientific.net/AMM.121-126.1550",
language = "English",
isbn = "9783037852828",
series = "Applied Mechanics and Materials",
pages = "1550--1554",
booktitle = "Frontiers of Manufacturing and Design Science II",

}

Chen, D-C, Chen, MR & Nian, FL 2012, A study on the cellphone cover-forming process of titanium alloys using the finite element method. in Frontiers of Manufacturing and Design Science II. Applied Mechanics and Materials, vol. 121-126, pp. 1550-1554, 2nd International Conference on Frontiers of Manufacturing and Design Science, ICFMD 2011, Taichung, Taiwan, 11-12-11. https://doi.org/10.4028/www.scientific.net/AMM.121-126.1550

A study on the cellphone cover-forming process of titanium alloys using the finite element method. / Chen, Dyi-Cheng; Chen, Ming Ren; Nian, Fung Ling.

Frontiers of Manufacturing and Design Science II. 2012. p. 1550-1554 (Applied Mechanics and Materials; Vol. 121-126).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - A study on the cellphone cover-forming process of titanium alloys using the finite element method

AU - Chen, Dyi-Cheng

AU - Chen, Ming Ren

AU - Nian, Fung Ling

PY - 2012/1/1

Y1 - 2012/1/1

N2 - In recent years, the style of 3C products demanded thin and small results due to gradual trends, though most of the industry is forming a continuous manner of stamping. However, the material thickness cannot be changed in products. This paper employs the rigid-plastic finite element (FE) DEFORM TM 3D software to investigate the plastic deformation behavior of titanium alloy (Ti-6Al-4V) workpiece for the forming processes of cellphone covers. In addition, this study utilizes the Solid Work 2010 3D graphics-rendering software for modeling, which is simulation software used to import various forming process conditions. The software analyzes the effective strain, the effective stress, critical damage value, and the die radius load distribution of the work-piece. Furthermore, this study used simulative software to analyze its forming processes for changes in grain size of the microstructure. The analytical results confirm the suitability of the current finite element software for forming processes of cellphone covers.

AB - In recent years, the style of 3C products demanded thin and small results due to gradual trends, though most of the industry is forming a continuous manner of stamping. However, the material thickness cannot be changed in products. This paper employs the rigid-plastic finite element (FE) DEFORM TM 3D software to investigate the plastic deformation behavior of titanium alloy (Ti-6Al-4V) workpiece for the forming processes of cellphone covers. In addition, this study utilizes the Solid Work 2010 3D graphics-rendering software for modeling, which is simulation software used to import various forming process conditions. The software analyzes the effective strain, the effective stress, critical damage value, and the die radius load distribution of the work-piece. Furthermore, this study used simulative software to analyze its forming processes for changes in grain size of the microstructure. The analytical results confirm the suitability of the current finite element software for forming processes of cellphone covers.

UR - http://www.scopus.com/inward/record.url?scp=81255168476&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=81255168476&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/AMM.121-126.1550

DO - 10.4028/www.scientific.net/AMM.121-126.1550

M3 - Conference contribution

AN - SCOPUS:81255168476

SN - 9783037852828

T3 - Applied Mechanics and Materials

SP - 1550

EP - 1554

BT - Frontiers of Manufacturing and Design Science II

ER -

Chen D-C, Chen MR, Nian FL. A study on the cellphone cover-forming process of titanium alloys using the finite element method. In Frontiers of Manufacturing and Design Science II. 2012. p. 1550-1554. (Applied Mechanics and Materials). https://doi.org/10.4028/www.scientific.net/AMM.121-126.1550