Abstract
This work presents a novel method based on the micromachined acoustic wave sensor for evaluating silicon membrane thickness. Like pressure sensors, accelerometers, micro flow sensors and micropumps, many micro-electro-mechanical systems (MEMS) devices require that silicon membrane thickness be known exactly. Precisely controlling silicon membrane thickness during wet etching is important, because the thickness strongly affects device performance and post-processing. The proposed method for evaluating silicon membrane thickness is novel, simple to implement, and can be monitored in-situ and mass-produced. The spectral analysis of surface waves (SASW), detailed process flows, measurement set-up and the experimental results also are presented.
| Original language | English |
|---|---|
| Pages (from-to) | 61-66 |
| Number of pages | 6 |
| Journal | Tamkang Journal of Science and Engineering |
| Volume | 7 |
| Issue number | 2 |
| Publication status | Published - 2004 Jun 1 |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
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A novel method for evaluating the thickness of silicon membrane using a micromachined acoustic wave sensor. / Lee, Chi Yuan; Cheng, Ying Chou; Wu, Tsung Tsong; Chen, Yung Yu; Chen, Wen Jong; Pao, Shih Yung; Chang, Pei Zen; Chen, Ping Hei; Yen, Kai Hsiang; Xiao, Fu Yuan.
In: Tamkang Journal of Science and Engineering, Vol. 7, No. 2, 01.06.2004, p. 61-66.Research output: Contribution to journal › Article
TY - JOUR
T1 - A novel method for evaluating the thickness of silicon membrane using a micromachined acoustic wave sensor
AU - Lee, Chi Yuan
AU - Cheng, Ying Chou
AU - Wu, Tsung Tsong
AU - Chen, Yung Yu
AU - Chen, Wen Jong
AU - Pao, Shih Yung
AU - Chang, Pei Zen
AU - Chen, Ping Hei
AU - Yen, Kai Hsiang
AU - Xiao, Fu Yuan
PY - 2004/6/1
Y1 - 2004/6/1
N2 - This work presents a novel method based on the micromachined acoustic wave sensor for evaluating silicon membrane thickness. Like pressure sensors, accelerometers, micro flow sensors and micropumps, many micro-electro-mechanical systems (MEMS) devices require that silicon membrane thickness be known exactly. Precisely controlling silicon membrane thickness during wet etching is important, because the thickness strongly affects device performance and post-processing. The proposed method for evaluating silicon membrane thickness is novel, simple to implement, and can be monitored in-situ and mass-produced. The spectral analysis of surface waves (SASW), detailed process flows, measurement set-up and the experimental results also are presented.
AB - This work presents a novel method based on the micromachined acoustic wave sensor for evaluating silicon membrane thickness. Like pressure sensors, accelerometers, micro flow sensors and micropumps, many micro-electro-mechanical systems (MEMS) devices require that silicon membrane thickness be known exactly. Precisely controlling silicon membrane thickness during wet etching is important, because the thickness strongly affects device performance and post-processing. The proposed method for evaluating silicon membrane thickness is novel, simple to implement, and can be monitored in-situ and mass-produced. The spectral analysis of surface waves (SASW), detailed process flows, measurement set-up and the experimental results also are presented.
UR - http://www.scopus.com/inward/record.url?scp=2942729810&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=2942729810&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:2942729810
VL - 7
SP - 61
EP - 66
JO - Journal of Applied Science and Engineering
JF - Journal of Applied Science and Engineering
SN - 1560-6686
IS - 2
ER -