A novel low temperature process for microwave dielectric ceramics metallization

Jau Jr Lin, Cheng I. Lin, Tune Hune Kao, Meng Chi Huang

Research output: Contribution to journalArticle

Abstract

This research proposes a novel low temperature process for microwave dielectric ceramics metallization with laser patterning and electroless copper plating. The process temperature of the proposed process is less than 50 °C, which is much lower than typical metallization technology, such as Low Temperature Co-fired Ceramics (LTCC) and Direct Bond Copper (DBC). Compared with LTCC and DBC, the proposed low temperature process can significantly reduce energy consumption, cut cost for cooling equipment, and offer smaller metal pattern variations. The measurement results demonstrate the line width error and the line position precision are all within ±50 μm. Moreover, this proposed process produces no short circuit or incomplete metallization in the walls of the holes. The measurement and simulation results demonstrate the manufactured samples meet the bandpass filter design specifications. Therefore, the proposed low temperature process is practical and adequate for producing microwave dielectric ceramics.

Original languageEnglish
Pages (from-to)1601-1606
Number of pages6
JournalApplied Computational Electromagnetics Society Journal
Volume37
Issue number10
Publication statusPublished - 2019 Jan 1

Fingerprint

Metallizing
Microwaves
ceramics
microwaves
copper
Temperature
Copper plating
short circuits
Copper
energy consumption
bandpass filters
plating
Electroless plating
specifications
Bandpass filters
Short circuit currents
Linewidth
costs
Energy utilization
cooling

All Science Journal Classification (ASJC) codes

  • Astronomy and Astrophysics
  • Electrical and Electronic Engineering

Cite this

Lin, Jau Jr ; Lin, Cheng I. ; Kao, Tune Hune ; Huang, Meng Chi. / A novel low temperature process for microwave dielectric ceramics metallization. In: Applied Computational Electromagnetics Society Journal. 2019 ; Vol. 37, No. 10. pp. 1601-1606.
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A novel low temperature process for microwave dielectric ceramics metallization. / Lin, Jau Jr; Lin, Cheng I.; Kao, Tune Hune; Huang, Meng Chi.

In: Applied Computational Electromagnetics Society Journal, Vol. 37, No. 10, 01.01.2019, p. 1601-1606.

Research output: Contribution to journalArticle

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