Abstract
This study is to develop a novel flip-chip on board packaging for an immersion electrochemical sensor which is able to detect the concentration of a target substance fast and accurately. The package was fabricated and the electrochemical measurement was performed to validate its function especially immersion capability and sensitivity. The calibration line for uric acid known concentrations were created firstly. Then test samples were measured and their values of concentration were determined according to the calibration line. Furthermore, the measurement results using the proposed electrochemical sensors were compared to the ones from the health examination in hospital where they use timed endpoint method typically. The comparison show that the measurement error between these two methods is less than 5% to represent the high consistency in the measurement of concentrations of uric acid. However, the new package with CV measurement provide the faster results of examination than the ones of hospital in regular process (24 hours). In summary, the proposed electrochemical sensor with flip-chip on board packaging technology demonstrate high accuracy of measurement, fast processing time, and low-cost for the application in uric acid detecting. More experiments are performed to offer a low-cost and fast detecting for a target substance in various applications.
| Original language | English |
|---|---|
| Title of host publication | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 |
| Publisher | IEEE Computer Society |
| Pages | 165-168 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781538656150 |
| DOIs | |
| Publication status | Published - 2019 Jan 24 |
| Event | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan Duration: 2018 Oct 24 → 2018 Oct 26 |
Publication series
| Name | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT |
|---|---|
| Volume | 2018-October |
| ISSN (Print) | 2150-5934 |
| ISSN (Electronic) | 2150-5942 |
Conference
| Conference | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 |
|---|---|
| Country | Taiwan |
| City | Taipei |
| Period | 18-10-24 → 18-10-26 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
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A novel disposable electrochemical sensor packaging with application for the detection of uric acid. / Gan, Zuo Xiang; Chen, Han Sheng; Lin, Yu Chang; Chung, Kuan-Jung.
13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2019. p. 165-168 8625822 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2018-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A novel disposable electrochemical sensor packaging with application for the detection of uric acid
AU - Gan, Zuo Xiang
AU - Chen, Han Sheng
AU - Lin, Yu Chang
AU - Chung, Kuan-Jung
PY - 2019/1/24
Y1 - 2019/1/24
N2 - This study is to develop a novel flip-chip on board packaging for an immersion electrochemical sensor which is able to detect the concentration of a target substance fast and accurately. The package was fabricated and the electrochemical measurement was performed to validate its function especially immersion capability and sensitivity. The calibration line for uric acid known concentrations were created firstly. Then test samples were measured and their values of concentration were determined according to the calibration line. Furthermore, the measurement results using the proposed electrochemical sensors were compared to the ones from the health examination in hospital where they use timed endpoint method typically. The comparison show that the measurement error between these two methods is less than 5% to represent the high consistency in the measurement of concentrations of uric acid. However, the new package with CV measurement provide the faster results of examination than the ones of hospital in regular process (24 hours). In summary, the proposed electrochemical sensor with flip-chip on board packaging technology demonstrate high accuracy of measurement, fast processing time, and low-cost for the application in uric acid detecting. More experiments are performed to offer a low-cost and fast detecting for a target substance in various applications.
AB - This study is to develop a novel flip-chip on board packaging for an immersion electrochemical sensor which is able to detect the concentration of a target substance fast and accurately. The package was fabricated and the electrochemical measurement was performed to validate its function especially immersion capability and sensitivity. The calibration line for uric acid known concentrations were created firstly. Then test samples were measured and their values of concentration were determined according to the calibration line. Furthermore, the measurement results using the proposed electrochemical sensors were compared to the ones from the health examination in hospital where they use timed endpoint method typically. The comparison show that the measurement error between these two methods is less than 5% to represent the high consistency in the measurement of concentrations of uric acid. However, the new package with CV measurement provide the faster results of examination than the ones of hospital in regular process (24 hours). In summary, the proposed electrochemical sensor with flip-chip on board packaging technology demonstrate high accuracy of measurement, fast processing time, and low-cost for the application in uric acid detecting. More experiments are performed to offer a low-cost and fast detecting for a target substance in various applications.
UR - http://www.scopus.com/inward/record.url?scp=85062475805&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85062475805&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2018.8625822
DO - 10.1109/IMPACT.2018.8625822
M3 - Conference contribution
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 165
EP - 168
BT - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PB - IEEE Computer Society
ER -