A new structure for CMOS thermal-bubble-based accelerometer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper, we design and fabrication a novel thermalbubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. It can detect two-dimension acceleration changed and apply to technology of inclinometers, anemometers and flow meters. A new accelerometer consists of a micro heater and two pairs of thermopiles floating over an etched cavity that is constructed by our proposed micro-link structure. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining he sensor to evaluate the performance of this accelerometer. The measurement shows the output signal is inverse proportional to the tilt angel and the output voltage is increased when he input power increases. Furthermore, the sensitivity was obtained for acceleration vs. output voltage with an average slope of '0.325μV/g in this case.

Original languageEnglish
Title of host publication2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement
Publication statusPublished - 2007 Sep 28
Event2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Synergy of Science and Technology in Instrumentation and Measurement - Warsaw, Poland
Duration: 2007 May 12007 May 3

Publication series

NameConference Record - IEEE Instrumentation and Measurement Technology Conference
ISSN (Print)1091-5281

Other

Other2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Synergy of Science and Technology in Instrumentation and Measurement
CountryPoland
CityWarsaw
Period07-05-0107-05-03

Fingerprint

Thermopiles
Accelerometers
Anemometers
Electric potential
Heat transfer
Fabrication
Sensors
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Shen, C-H., Chen, S. J., & Yang, Y. T. (2007). A new structure for CMOS thermal-bubble-based accelerometer. In 2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement [4258092] (Conference Record - IEEE Instrumentation and Measurement Technology Conference).
Shen, Chih-Hsiung ; Chen, Shu Jung ; Yang, Yin Ting. / A new structure for CMOS thermal-bubble-based accelerometer. 2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement. 2007. (Conference Record - IEEE Instrumentation and Measurement Technology Conference).
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Shen, C-H, Chen, SJ & Yang, YT 2007, A new structure for CMOS thermal-bubble-based accelerometer. in 2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement., 4258092, Conference Record - IEEE Instrumentation and Measurement Technology Conference, 2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Synergy of Science and Technology in Instrumentation and Measurement, Warsaw, Poland, 07-05-01.

A new structure for CMOS thermal-bubble-based accelerometer. / Shen, Chih-Hsiung; Chen, Shu Jung; Yang, Yin Ting.

2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement. 2007. 4258092 (Conference Record - IEEE Instrumentation and Measurement Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - In this paper, we design and fabrication a novel thermalbubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. It can detect two-dimension acceleration changed and apply to technology of inclinometers, anemometers and flow meters. A new accelerometer consists of a micro heater and two pairs of thermopiles floating over an etched cavity that is constructed by our proposed micro-link structure. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining he sensor to evaluate the performance of this accelerometer. The measurement shows the output signal is inverse proportional to the tilt angel and the output voltage is increased when he input power increases. Furthermore, the sensitivity was obtained for acceleration vs. output voltage with an average slope of '0.325μV/g in this case.

AB - In this paper, we design and fabrication a novel thermalbubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. It can detect two-dimension acceleration changed and apply to technology of inclinometers, anemometers and flow meters. A new accelerometer consists of a micro heater and two pairs of thermopiles floating over an etched cavity that is constructed by our proposed micro-link structure. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining he sensor to evaluate the performance of this accelerometer. The measurement shows the output signal is inverse proportional to the tilt angel and the output voltage is increased when he input power increases. Furthermore, the sensitivity was obtained for acceleration vs. output voltage with an average slope of '0.325μV/g in this case.

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Shen C-H, Chen SJ, Yang YT. A new structure for CMOS thermal-bubble-based accelerometer. In 2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement. 2007. 4258092. (Conference Record - IEEE Instrumentation and Measurement Technology Conference).