TY - GEN
T1 - A new architecture of LCD driver of rail-to-rail buffer with high gain wide range
AU - Lin, Shih Han
AU - Chen, Shu Jung
AU - Shen, Chih Hsiung
N1 - Copyright:
Copyright 2010 Elsevier B.V., All rights reserved.
PY - 2010
Y1 - 2010
N2 - A new modified CMOS buffer amplifier with rail-to-rail input and output range is proposed by TSMC 0.35μm 2P4M process at 3.3V supply. The technique adds dummy pairs to sense the common mode range of the input differential pair and adjusts the output current accordingly. The amplifier provides high gain for a wider range of output voltages. Design considerations for reducing the impact of the additional circuitry on the core are provided. The technique described can be adapted for use with traditional fully-differential rail-to-rail amplifiers, which performs 86.9dB ∼92dB dc gain, 15 MHz unit-gain bandwidth, high driving ability with high slew rate under a 100pF capacitance and a 3kΩ series resistance loading. The simulation results indicate that the settling times of rising and falling edge are within 3.5μs. It is effective for a high resolution and high speed LCD driver.
AB - A new modified CMOS buffer amplifier with rail-to-rail input and output range is proposed by TSMC 0.35μm 2P4M process at 3.3V supply. The technique adds dummy pairs to sense the common mode range of the input differential pair and adjusts the output current accordingly. The amplifier provides high gain for a wider range of output voltages. Design considerations for reducing the impact of the additional circuitry on the core are provided. The technique described can be adapted for use with traditional fully-differential rail-to-rail amplifiers, which performs 86.9dB ∼92dB dc gain, 15 MHz unit-gain bandwidth, high driving ability with high slew rate under a 100pF capacitance and a 3kΩ series resistance loading. The simulation results indicate that the settling times of rising and falling edge are within 3.5μs. It is effective for a high resolution and high speed LCD driver.
UR - http://www.scopus.com/inward/record.url?scp=77950968197&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77950968197&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.97-101.3765
DO - 10.4028/www.scientific.net/AMR.97-101.3765
M3 - Conference contribution
AN - SCOPUS:77950968197
SN - 0878492801
SN - 9780878492800
T3 - Advanced Materials Research
SP - 3765
EP - 3768
BT - Manufacturing Science and Engineering I
T2 - 2009 International Conference on Manufacturing Science and Engineering, ICMSE 2009
Y2 - 26 December 2009 through 28 December 2009
ER -