A new approach of 2d CMOS thermal-bubble-based accelerometer

Yin Ting Yang; Shu Jong Chen; Wei Te Lin; Wei Hong Tu; Chun An Huang; Wen Ling Liu; Chih Hsiung Shen

doi:10.1109/IECON.2007.4460215

A new approach of 2d CMOS thermal-bubble-based accelerometer

Yin Ting Yang, Shu Jong Chen, Wei Te Lin, Wei Hong Tu, Chun An Huang, Wen Ling Liu, Chih Hsiung Shen

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

A novel thermal-bubble-based micro machined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.

Original language	English
Title of host publication	Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
Pages	2980-2984
Number of pages	5
DOIs	https://doi.org/10.1109/IECON.2007.4460215
Publication status	Published - 2007 Dec 1
Event	33rd Annual Conference of the IEEE Industrial Electronics Society, IECON - Taipei, Taiwan Duration: 2007 Nov 5 → 2007 Nov 8

Publication series

Name	IECON Proceedings (Industrial Electronics Conference)

Other

Other	33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
Country	Taiwan
City	Taipei
Period	07-11-05 → 07-11-08

All Science Journal Classification (ASJC) codes

Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/IECON.2007.4460215

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Yang, Y. T., Chen, S. J., Lin, W. T., Tu, W. H., Huang, C. A., Liu, W. L., & Shen, C. H. (2007). A new approach of 2d CMOS thermal-bubble-based accelerometer. In Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON (pp. 2980-2984). [4460215] (IECON Proceedings (Industrial Electronics Conference)). https://doi.org/10.1109/IECON.2007.4460215

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title = "A new approach of 2d CMOS thermal-bubble-based accelerometer",

abstract = "A novel thermal-bubble-based micro machined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.",

author = "Yang, {Yin Ting} and Chen, {Shu Jong} and Lin, {Wei Te} and Tu, {Wei Hong} and Huang, {Chun An} and Liu, {Wen Ling} and Shen, {Chih Hsiung}",

year = "2007",

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doi = "10.1109/IECON.2007.4460215",

language = "English",

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Yang, YT, Chen, SJ, Lin, WT, Tu, WH, Huang, CA, Liu, WL & Shen, CH 2007, A new approach of 2d CMOS thermal-bubble-based accelerometer. in Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON., 4460215, IECON Proceedings (Industrial Electronics Conference), pp. 2980-2984, 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON, Taipei, Taiwan, 07-11-05. https://doi.org/10.1109/IECON.2007.4460215

A new approach of 2d CMOS thermal-bubble-based accelerometer. / Yang, Yin Ting; Chen, Shu Jong; Lin, Wei Te; Tu, Wei Hong; Huang, Chun An; Liu, Wen Ling; Shen, Chih Hsiung.

Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. 2007. p. 2980-2984 4460215 (IECON Proceedings (Industrial Electronics Conference)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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