A new approach of 2d CMOS thermal-bubble-based accelerometer

Yin Ting Yang, Shu Jong Chen, Wei Te Lin, Wei Hong Tu, Chun An Huang, Wen Ling Liu, Chih Hsiung Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A novel thermal-bubble-based micro machined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.

Original languageEnglish
Title of host publicationProceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
Pages2980-2984
Number of pages5
DOIs
Publication statusPublished - 2007 Dec 1
Event33rd Annual Conference of the IEEE Industrial Electronics Society, IECON - Taipei, Taiwan
Duration: 2007 Nov 52007 Nov 8

Publication series

NameIECON Proceedings (Industrial Electronics Conference)

Other

Other33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
CountryTaiwan
CityTaipei
Period07-11-0507-11-08

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Yang, Y. T., Chen, S. J., Lin, W. T., Tu, W. H., Huang, C. A., Liu, W. L., & Shen, C. H. (2007). A new approach of 2d CMOS thermal-bubble-based accelerometer. In Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON (pp. 2980-2984). [4460215] (IECON Proceedings (Industrial Electronics Conference)). https://doi.org/10.1109/IECON.2007.4460215