Abstract
A novel thermal-bubble-based micro machined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON |
| Pages | 2980-2984 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2007 Dec 1 |
| Event | 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON - Taipei, Taiwan Duration: 2007 Nov 5 → 2007 Nov 8 |
Publication series
| Name | IECON Proceedings (Industrial Electronics Conference) |
|---|
Other
| Other | 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON |
|---|---|
| Country | Taiwan |
| City | Taipei |
| Period | 07-11-05 → 07-11-08 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
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A new approach of 2d CMOS thermal-bubble-based accelerometer. / Yang, Yin Ting; Chen, Shu Jong; Lin, Wei Te; Tu, Wei Hong; Huang, Chun An; Liu, Wen Ling; Shen, Chih Hsiung.
Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. 2007. p. 2980-2984 4460215 (IECON Proceedings (Industrial Electronics Conference)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A new approach of 2d CMOS thermal-bubble-based accelerometer
AU - Yang, Yin Ting
AU - Chen, Shu Jong
AU - Lin, Wei Te
AU - Tu, Wei Hong
AU - Huang, Chun An
AU - Liu, Wen Ling
AU - Shen, Chih Hsiung
PY - 2007/12/1
Y1 - 2007/12/1
N2 - A novel thermal-bubble-based micro machined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.
AB - A novel thermal-bubble-based micro machined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are crossed with each other. The heater and the thermopiles are connected by network structure of micro-links, which enhance the structure and greatly reduce the solid heat flow from the heater to the hot junctions of thermopiles. Furthermore, the samples are fabricated by TSMC 0.35μm 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production.
UR - http://www.scopus.com/inward/record.url?scp=49949111614&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=49949111614&partnerID=8YFLogxK
U2 - 10.1109/IECON.2007.4460215
DO - 10.1109/IECON.2007.4460215
M3 - Conference contribution
AN - SCOPUS:49949111614
SN - 1424407834
SN - 9781424407835
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 2980
EP - 2984
BT - Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
ER -