A low-power multi-Vdd dual-core motion estimation chip design and implementation for wireless panoramic endoscopy

Jian Lin Zeng, Tsung-Yi Wu, Ching Hwa Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, a low-power motion estimation designed chip was proposed for wireless panoramic endoscope system. This design consists of the motion estimation system and implemented by a low-power hardware design technique. There are two parts to the architecture of the motion estimation system. The first part is the one-dimensional processing element array to calculate the absolute difference. The second part is the adder tree that is used to compute the sum of the absolute difference. On the low-power technique, the circuit was separated into two voltage domains by using the clustered voltage scaling. The high voltage maintains the performance of the circuit and the low voltage reduces the power consumption. It is one of the most effective techniques in reducing the power consumption without reducing the performance of the circuit.

Original languageEnglish
Title of host publication2016 5th International Symposium on Next-Generation Electronics, ISNE 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509024391
DOIs
Publication statusPublished - 2016 Aug 12
Event5th International Symposium on Next-Generation Electronics, ISNE 2016 - Hsinchu, Taiwan
Duration: 2016 May 42016 May 6

Other

Other5th International Symposium on Next-Generation Electronics, ISNE 2016
CountryTaiwan
CityHsinchu
Period16-05-0416-05-06

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Zeng, J. L., Wu, T-Y., & Cheng, C. H. (2016). A low-power multi-Vdd dual-core motion estimation chip design and implementation for wireless panoramic endoscopy. In 2016 5th International Symposium on Next-Generation Electronics, ISNE 2016 [7543383] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISNE.2016.7543383