A low offset high voltage swing rail-to-rail buffer amplifier for LCD driver

Guo Teng Hong, Chih-Hsiung Shen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The size of LCDs is getting larger in particular , it is essential to compromise the driving ability. So , source drivers with high performance , high resolution , and low power dissipation will achieve more additional value. This paper presents a design and implementation of using 10-bit multiple DAC ( Digital to Analog Converter ) for the driver , and proposes a rail-to-rail output buffer with low offset and high driving ability. We designed a class-B output buffer with offset compensation ability to reduce the nonlinearity of output voltage. With the H-SPICE model of TSMC 0.35μm 2P4M 3.3V / 5V process , the maximum offset is less than 2mV , and the input / output swing are nearly full swing. Besides , it also performs a rail-to-rail swing range and high slew rate of 14 V / μs and 11.5 V / μs for rising and falling edges under a 400 pF capacitance load. For high driving capability , two push-pull output stages are used , two frequency compensation stages are also introduced for stability , one is the miller compensation with 0.04 pF capacitance , and the other is zero compensation with 0.1 kΩ added between two push-pull output stages for stable driving under different capacitance loads. The result exhibits that the settling time are within 5μs under the max voltage swing with voltage 5V under a 400 pF capacitance load. Even under a 1000 pF capacitance load , it still has the settling time of 1.52 μs and 1.80 μs for rising and falling edges , respectively. The effective area of this buffer is only 100 × 100 μm2 with build-in offset voltage holding capacitor.

Original languageEnglish
Title of host publicationIEEE Conference on Electron Devices and Solid-State Circuits 2007, EDSSC 2007
Pages841-846
Number of pages6
DOIs
Publication statusPublished - 2007 Dec 1
EventIEEE Conference on Electron Devices and Solid-State Circuits 2007, EDSSC 2007 - Tainan, Taiwan
Duration: 2007 Dec 202007 Dec 22

Publication series

NameIEEE Conference on Electron Devices and Solid-State Circuits 2007, EDSSC 2007

Other

OtherIEEE Conference on Electron Devices and Solid-State Circuits 2007, EDSSC 2007
CountryTaiwan
CityTainan
Period07-12-2007-12-22

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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