Abstract
The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 |
| Pages | 1594-1598 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2010 Dec 30 |
| Event | 2010 3rd International Congress on Image and Signal Processing, CISP 2010 - Yantai, China Duration: 2010 Oct 16 → 2010 Oct 18 |
Publication series
| Name | Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 |
|---|---|
| Volume | 4 |
Other
| Other | 2010 3rd International Congress on Image and Signal Processing, CISP 2010 |
|---|---|
| Country | China |
| City | Yantai |
| Period | 10-10-16 → 10-10-18 |
All Science Journal Classification (ASJC) codes
- Computer Vision and Pattern Recognition
- Signal Processing
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Cite this
Chen, M-F., Ho, Y. S., & Wang, S. M. (2010). A fast positioning method with pattern tracking for automatic wafer alignment. In Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 (pp. 1594-1598). [5647710] (Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010; Vol. 4). https://doi.org/10.1109/CISP.2010.5647710