TY - GEN
T1 - A fast positioning method with pattern tracking for automatic wafer alignment
AU - Chen, Ming-Fei
AU - Ho, Yu Sen
AU - Wang, Shen Mao
PY - 2010/12/30
Y1 - 2010/12/30
N2 - The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.
AB - The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.
UR - http://www.scopus.com/inward/record.url?scp=78650556982&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78650556982&partnerID=8YFLogxK
U2 - 10.1109/CISP.2010.5647710
DO - 10.1109/CISP.2010.5647710
M3 - Conference contribution
AN - SCOPUS:78650556982
SN - 9781424465149
T3 - Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
SP - 1594
EP - 1598
BT - Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
T2 - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
Y2 - 16 October 2010 through 18 October 2010
ER -