A fast positioning method with pattern tracking for automatic wafer alignment

Ming-Fei Chen, Yu Sen Ho, Shen Mao Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.

Original languageEnglish
Title of host publicationProceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
Pages1594-1598
Number of pages5
DOIs
Publication statusPublished - 2010 Dec 30
Event2010 3rd International Congress on Image and Signal Processing, CISP 2010 - Yantai, China
Duration: 2010 Oct 162010 Oct 18

Publication series

NameProceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
Volume4

Other

Other2010 3rd International Congress on Image and Signal Processing, CISP 2010
CountryChina
CityYantai
Period10-10-1610-10-18

All Science Journal Classification (ASJC) codes

  • Computer Vision and Pattern Recognition
  • Signal Processing

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  • Cite this

    Chen, M-F., Ho, Y. S., & Wang, S. M. (2010). A fast positioning method with pattern tracking for automatic wafer alignment. In Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 (pp. 1594-1598). [5647710] (Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010; Vol. 4). https://doi.org/10.1109/CISP.2010.5647710