A fast positioning method with pattern tracking for automatic wafer alignment

Ming-Fei Chen; Yu Sen Ho; Shen Mao Wang

doi:10.1109/CISP.2010.5647710

A fast positioning method with pattern tracking for automatic wafer alignment

Ming-Fei Chen, Yu Sen Ho, Shen Mao Wang

Department of Mechatronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.

Original language	English
Title of host publication	Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
Pages	1594-1598
Number of pages	5
DOIs	https://doi.org/10.1109/CISP.2010.5647710
Publication status	Published - 2010 Dec 30
Event	2010 3rd International Congress on Image and Signal Processing, CISP 2010 - Yantai, China Duration: 2010 Oct 16 → 2010 Oct 18

Publication series

Name	Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
Volume	4

Other

Other	2010 3rd International Congress on Image and Signal Processing, CISP 2010
Country	China
City	Yantai
Period	10-10-16 → 10-10-18

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All Science Journal Classification (ASJC) codes

Computer Vision and Pattern Recognition
Signal Processing

Cite this

Chen, M-F., Ho, Y. S., & Wang, S. M. (2010). A fast positioning method with pattern tracking for automatic wafer alignment. In Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 (pp. 1594-1598). [5647710] (Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010; Vol. 4). https://doi.org/10.1109/CISP.2010.5647710

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title = "A fast positioning method with pattern tracking for automatic wafer alignment",

abstract = "The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.",

author = "Ming-Fei Chen and Ho, {Yu Sen} and Wang, {Shen Mao}",

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Chen, M-F, Ho, YS & Wang, SM 2010, A fast positioning method with pattern tracking for automatic wafer alignment. in Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010., 5647710, Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010, vol. 4, pp. 1594-1598, 2010 3rd International Congress on Image and Signal Processing, CISP 2010, Yantai, China, 10-10-16. https://doi.org/10.1109/CISP.2010.5647710

A fast positioning method with pattern tracking for automatic wafer alignment. / Chen, Ming-Fei; Ho, Yu Sen; Wang, Shen Mao.

Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010. 2010. p. 1594-1598 5647710 (Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010; Vol. 4).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.

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Access to Document

10.1109/CISP.2010.5647710