Abstract
The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 |
| Pages | 1594-1598 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2010 Dec 30 |
| Event | 2010 3rd International Congress on Image and Signal Processing, CISP 2010 - Yantai, China Duration: 2010 Oct 16 → 2010 Oct 18 |
Publication series
| Name | Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010 |
|---|---|
| Volume | 4 |
Other
| Other | 2010 3rd International Congress on Image and Signal Processing, CISP 2010 |
|---|---|
| Country | China |
| City | Yantai |
| Period | 10-10-16 → 10-10-18 |
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All Science Journal Classification (ASJC) codes
- Computer Vision and Pattern Recognition
- Signal Processing
Cite this
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A fast positioning method with pattern tracking for automatic wafer alignment. / Chen, Ming-Fei; Ho, Yu Sen; Wang, Shen Mao.
Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010. 2010. p. 1594-1598 5647710 (Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010; Vol. 4).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - A fast positioning method with pattern tracking for automatic wafer alignment
AU - Chen, Ming-Fei
AU - Ho, Yu Sen
AU - Wang, Shen Mao
PY - 2010/12/30
Y1 - 2010/12/30
N2 - The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.
AB - The applicable wafer bonding process for semiconductor industry is usually administered in a three-dimensional oxides structure design. The bonding technology of the silicon-silicon wafer is an important process because the mechanical structure and the circuit layout of the wafer surface must be positioned accurately. This study focuses on the automatic alignment algorithms for the wafer bonding system, in which the crisscross marks on the surfaces of the two wafers aligned by pattern recognition and image processing technology and a fast positioning system with feedback control to achieve a fast and accurate wafer bonding process.
UR - http://www.scopus.com/inward/record.url?scp=78650556982&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78650556982&partnerID=8YFLogxK
U2 - 10.1109/CISP.2010.5647710
DO - 10.1109/CISP.2010.5647710
M3 - Conference contribution
AN - SCOPUS:78650556982
SN - 9781424465149
T3 - Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
SP - 1594
EP - 1598
BT - Proceedings - 2010 3rd International Congress on Image and Signal Processing, CISP 2010
ER -