Abstract
Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3 D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and laser Doppler velocity meter experimentally. Both 3D finite element simulation and experimental results reach similar transducer's tip motion behavior for future study.
| Original language | English |
|---|---|
| Title of host publication | 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 |
| Pages | 158-163 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2009 Dec 1 |
| Event | 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 - Changchun, China Duration: 2009 Aug 9 → 2009 Aug 12 |
Other
| Other | 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 |
|---|---|
| Country | China |
| City | Changchun |
| Period | 09-08-09 → 09-08-12 |
All Science Journal Classification (ASJC) codes
- Computer Vision and Pattern Recognition
- Control and Systems Engineering
- Electrical and Electronic Engineering
Fingerprint Dive into the research topics of '3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion'. Together they form a unique fingerprint.
Cite this
Hsiao, F. S., Chao, J. A., & Huang, Y. C. (2009). 3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion. In 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 (pp. 158-163). [5246089] https://doi.org/10.1109/ICMA.2009.5246089