Abstract
Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3 D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and laser Doppler velocity meter experimentally. Both 3D finite element simulation and experimental results reach similar transducer's tip motion behavior for future study.
| Original language | English |
|---|---|
| Title of host publication | 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 |
| Pages | 158-163 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2009 Dec 1 |
| Event | 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 - Changchun, China Duration: 2009 Aug 9 → 2009 Aug 12 |
Other
| Other | 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 |
|---|---|
| Country | China |
| City | Changchun |
| Period | 09-08-09 → 09-08-12 |
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All Science Journal Classification (ASJC) codes
- Computer Vision and Pattern Recognition
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
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3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion. / Hsiao, Fu Sheng; Chao, Jen Ai; Huang, Yi Cheng.
2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009. 2009. p. 158-163 5246089.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - 3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion
AU - Hsiao, Fu Sheng
AU - Chao, Jen Ai
AU - Huang, Yi Cheng
PY - 2009/12/1
Y1 - 2009/12/1
N2 - Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3 D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and laser Doppler velocity meter experimentally. Both 3D finite element simulation and experimental results reach similar transducer's tip motion behavior for future study.
AB - Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3 D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and laser Doppler velocity meter experimentally. Both 3D finite element simulation and experimental results reach similar transducer's tip motion behavior for future study.
UR - http://www.scopus.com/inward/record.url?scp=77449145095&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77449145095&partnerID=8YFLogxK
U2 - 10.1109/ICMA.2009.5246089
DO - 10.1109/ICMA.2009.5246089
M3 - Conference contribution
AN - SCOPUS:77449145095
SN - 9781424426935
SP - 158
EP - 163
BT - 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009
ER -