3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion

Fu Sheng Hsiao, Jen Ai Chao, Yi Cheng Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3 D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and laser Doppler velocity meter experimentally. Both 3D finite element simulation and experimental results reach similar transducer's tip motion behavior for future study.

Original languageEnglish
Title of host publication2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009
Pages158-163
Number of pages6
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 - Changchun, China
Duration: 2009 Aug 92009 Aug 12

Other

Other2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009
CountryChina
CityChangchun
Period09-08-0909-08-12

All Science Journal Classification (ASJC) codes

  • Computer Vision and Pattern Recognition
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Hsiao, F. S., Chao, J. A., & Huang, Y. C. (2009). 3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion. In 2009 IEEE International Conference on Mechatronics and Automation, ICMA 2009 (pp. 158-163). [5246089] https://doi.org/10.1109/ICMA.2009.5246089