12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation

Tzung Ming Chen; Stefan Krausse; Jan G. Korvink; Ulrike Wallrabe

doi:10.1109/MEMSYS.2010.5442442

12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation

Tzung Ming Chen, Stefan Krausse, Jan G. Korvink, Ulrike Wallrabe

Department of Industrial Education and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.

Original language	English
Title of host publication	MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
Pages	552-555
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2010.5442442
Publication status	Published - 2010 Jun 1
Event	23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China Duration: 2010 Jan 24 → 2010 Jan 28

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Other

Other	23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
Country	China
City	Hong Kong
Period	10-01-24 → 10-01-28

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMSYS.2010.5442442

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Chen, T. M., Krausse, S., Korvink, J. G., & Wallrabe, U. (2010). 12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest (pp. 552-555). [5442442] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2010.5442442

Chen, Tzung Ming ; Krausse, Stefan ; Korvink, Jan G. ; Wallrabe, Ulrike. / 12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation. MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. pp. 552-555 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{50e431b9938f4b5aadce0b3c4d8471dc,

title = "12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation",

abstract = "We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.",

author = "Chen, {Tzung Ming} and Stefan Krausse and Korvink, {Jan G.} and Ulrike Wallrabe",

year = "2010",

month = jun,

day = "1",

doi = "10.1109/MEMSYS.2010.5442442",

language = "English",

isbn = "9781424457649",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "552--555",

booktitle = "MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest",

note = "23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 ; Conference date: 24-01-2010 Through 28-01-2010",

}

Chen, TM, Krausse, S, Korvink, JG & Wallrabe, U 2010, 12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation. in MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest., 5442442, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 552-555, 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010, Hong Kong, China, 10-01-24. https://doi.org/10.1109/MEMSYS.2010.5442442

12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation. / Chen, Tzung Ming; Krausse, Stefan; Korvink, Jan G.; Wallrabe, Ulrike.

MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. p. 552-555 5442442 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - 12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation

AU - Chen, Tzung Ming

AU - Krausse, Stefan

AU - Korvink, Jan G.

AU - Wallrabe, Ulrike

PY - 2010/6/1

Y1 - 2010/6/1

N2 - We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.

AB - We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.

UR - http://www.scopus.com/inward/record.url?scp=77952767735&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77952767735&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2010.5442442

DO - 10.1109/MEMSYS.2010.5442442

M3 - Conference contribution

AN - SCOPUS:77952767735

SN - 9781424457649

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 552

EP - 555

BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest

T2 - 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010

Y2 - 24 January 2010 through 28 January 2010

ER -

Chen TM, Krausse S, Korvink JG, Wallrabe U. 12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. p. 552-555. 5442442. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2010.5442442