Abstract
We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.
| Original language | English |
|---|---|
| Title of host publication | MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest |
| Pages | 552-555 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2010 Jun 1 |
| Event | 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China Duration: 2010 Jan 24 → 2010 Jan 28 |
Publication series
| Name | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
|---|---|
| ISSN (Print) | 1084-6999 |
Other
| Other | 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 |
|---|---|
| Country | China |
| City | Hong Kong |
| Period | 10-01-24 → 10-01-28 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Mechanical Engineering
- Electrical and Electronic Engineering
Cite this
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12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation. / Chen, Tzung Ming; Krausse, Stefan; Korvink, Jan G.; Wallrabe, Ulrike.
MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. p. 552-555 5442442 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - 12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation
AU - Chen, Tzung Ming
AU - Krausse, Stefan
AU - Korvink, Jan G.
AU - Wallrabe, Ulrike
PY - 2010/6/1
Y1 - 2010/6/1
N2 - We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.
AB - We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.
UR - http://www.scopus.com/inward/record.url?scp=77952767735&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77952767735&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2010.5442442
DO - 10.1109/MEMSYS.2010.5442442
M3 - Conference contribution
AN - SCOPUS:77952767735
SN - 9781424457649
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 552
EP - 555
BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
ER -