12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation

Tzung Ming Chen, Stefan Krausse, Jan G. Korvink, Ulrike Wallrabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We present a new 12° design rule to enhance the reliability of single crystal silicon (SCS) compliant mechanism with large deformation. This rule defines a suitable structure orientation on an SCS wafer and avoids failure of stress induced crystal slip on curved compliant beams. Our rule considers the crystalline directional properties, such as Young's Modulus and fracture strength, of SCS. We fabricated a rotational mirror as demonstrator which was displaced by a piezoelectric actuator. Obeying to the 12° design rule we achieved a 100% larger rotational angle at the mirror section than in case of arbitrary orientation.

Original languageEnglish
Title of host publicationMEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
Pages552-555
Number of pages4
DOIs
Publication statusPublished - 2010 Jun 1
Event23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China
Duration: 2010 Jan 242010 Jan 28

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
CountryChina
CityHong Kong
Period10-01-2410-01-28

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Chen, T. M., Krausse, S., Korvink, J. G., & Wallrabe, U. (2010). 12° design rule for single crystal silicon curved beam compliant mechanisms with large deformation. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest (pp. 552-555). [5442442] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2010.5442442