Kuan-Jung Chung

Associate Professor

  • 73 Citations
  • 5 h-Index
20012019

Research output per year

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Research Output

  • 73 Citations
  • 5 h-Index
  • 22 Conference contribution
  • 9 Article
  • 1 Conference article
  • 1 Patent
2019

A novel disposable electrochemical sensor packaging with application for the detection of uric acid

Gan, Z. X., Chen, H. S., Lin, Y. C. & Chung, K. J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 165-168 4 p. 8625822. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
1 Citation (Scopus)

The Prediction of Positioning shift for a Robot Arm Using Machine Learning Techniques

Huang, P. W. & Chung, K. J., 2019 Oct, IMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding. IEEE Computer Society, p. 58-61 4 p. 9024996. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2019-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2018

Prognostic-based reliability assessment of a wafer handling robot arm using Wiener stochastic process model and Monte Carlo simulation

Huang, J. H., Cheng, H. M., Li, Y. R. & Chung, K. J., 2018 Jan 1, Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design. Pham, H. (ed.). International Society of Science and Applied Technologies, p. 1-5 5 p. (Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

工具機具殘餘使用壽命預測系統及方法

Chung, K-J., 2018 Nov 1, Patent No. 1639907

Research output: Patent

2017

Estimating activation energy of the LiFePO4 battery using dual dynamic stress accelerated degradation tests

Lin, Y. C., Li, Y. R. & Chung, K. J., 2017 Jan 1, Conference Proceedings - 23rd ISSAT International Conference on Reliability and Quality in Design. Pham, H. (ed.). International Society of Science and Applied Technologies, p. 121-125 5 p. (Conference Proceedings - 23rd ISSAT International Conference on Reliability and Quality in Design).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Predicting the degradation of li-ion battery using advanced machine learning techniques

Li, Y. R. & Chung, K. J., 2017 Jul 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 258-262 5 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2017-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2016

Predicting the lifetimes of LiFePO4 batteries on the basis of the gamma process through accelerated degradation measurements

Lin, Y. C. & Chung, K. J., 2016 Aug 12, 2016 IEEE International Conference on Prognostics and Health Management, ICPHM 2016. Institute of Electrical and Electronics Engineers Inc., 7542849

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2015

Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process

Chen, C. Y., Wu, R. F., Huang, C. Y. & Chung, K. J., 2015 Dec 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 213-216 4 p. 7365251

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2014

Development of a leakage-free disposable package for biosensors immersed in the chemical solutions

Chung, K. J. & Wu, C. C., 2014 Jan 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 488-490 3 p. 7048439. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2013

A novel double dynamic stress accelerated degradation test to evaluate power fade of batteries for electric vehicles

Lin, Y. C., Chung, K. J. & Hsiao, C. C., 2013 Aug 8, Intelligent Technologies and Engineering Systems. p. 161-168 8 p. (Lecture Notes in Electrical Engineering; vol. 234 LNEE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

A patterning technique of lead zirconate titanate thin film by ultraviolet-light

Wu, C. C., Hsueh, C. H., Chang, Y. T., Chang, C. T. & Chung, K-J., 2013 Jun 1, In : Microsystem Technologies. 19, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Design optimization of laser-induced microbridges for low resistance interline connections in ICs

Chung, K. J., Peckerar, M. & Bernstein, J. B., 2013 Mar, In : Microelectronic Engineering. 103, p. 70-75 6 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Effect of strain rates on the mechanical behavior of Cu thin films of various thicknesses

Chung, K-J., Lin, C. F. & Chiang, W. C., 2013 Feb 20, Innovation for Applied Science and Technology. p. 94-97 4 p. (Applied Mechanics and Materials; vol. 284-287).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Mechanical behavior of copper thin films subjected to various strain rate loadings

Chung, K. J., Lin, C. F. & Chiang, W. C., 2013, In : Transactions of the Canadian Society for Mechanical Engineering. 37, 3, p. 861-871 11 p.

Research output: Contribution to journalArticle

4 Citations (Scopus)
2012

Accelerated degradation assessment of 18650 lithium-ion batteries

Chung, K. J. & Hsiao, C. C., 2012 Jul 30, Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012. p. 930-933 4 p. 6228224. (Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Linear energy control of laser drilling and its application in the repair of TFT-LCD bright pixels

Chen, T., Lin, M. T. & Chung, K. J., 2012 Nov 1, In : Microsystem Technologies. 18, 11, p. 1909-1915 7 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Reliability tests of a RFID-based lock for power meter applications

Chung, K-J., Jan, C. W., Chen, C. C. & Tsai, S. C., 2012 Jul 30, Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012. p. 945-948 4 p. 6228228. (Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2011

The solder joint reliability assessment of a wafer level CSP package

Chung, K-J., Tseng, C. H. & Yang, L., 2011 Dec 1, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 370-372 3 p. 6117252. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2010

Experimental investigation of the optimal laser-induced microbridges

Chung, K. J. & Bernstein, J. B., 2010 Jul 1, In : Precision Engineering. 34, 3, p. 578-585 8 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS

Tong, C. J., Cheng, Y. C., Lin, M. T., Chung, K. J., Hsu, J. S. & Wu, C. L., 2010 Jul 1, In : Microsystem Technologies. 16, 7, p. 1131-1137 7 p.

Research output: Contribution to journalArticle

17 Citations (Scopus)

The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages

Chung, K. J., Yang, L., Wang, B. Y. & Wu, C. C., 2010 Dec 1, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699640. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)
2009

Measure the mechanical behavior of thin films using four step phase-shifting methods on the novel paddle cantilever beam

Lin, M. T., Tong, C. J., Cheng, Y. C., Chung, K. J. & Hsu, J. S., 2009 Dec 1, Society for Experimental Mechanics - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2009. p. 2387-2393 7 p. (Society for Experimental Mechanics - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2009; vol. 4).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method

Lin, M. T., Tong, C. J., Cheng, Y. C., Chung, K-J. & Hsu, J. S., 2009 Sep 23, 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009. p. 140-144 5 p. 4919482. (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2006

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K-J., Bernstein, J. B., Luo, J. I., Tuchman, J. A. & Ma, Z. K., 2006 Jan 1, Conference on Lasers and Electro-Optics, CLEO 2006. Optical Society of America, (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2005

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K. J., Bernstein, J. B., Luo, J., Tuchman, J. A. & Ma, Z. K., 2005 Jan 1, Quantum Electronics and Laser Science Conference, QELS 2005. Optical Society of America, (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K. J., Bernstein, J. B., Luo, J. I., Tuchman, J. A. & Ma, Z. K., 2005 Oct 31, 2005 Quantum Electronics and Laser Science Conference (QELS). p. 1564-1566 3 p. (Quantum Electronics and Laser Science Conference (QELS); vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K-J., Bernstein, J. B., Luo, J. I., Tuchman, J. A. & Ma, Z. K., 2005 Jan 1, Conference on Lasers and Electro-Optics, CLEO 2005. Optical Society of America, (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2004

A high performance radiation-hard field programmable analog array

Luo, J., Bernstein, J. B., Tuchman, J. A., Huang, H., Chung, K. J. & Wilson, A. L., 2004, Proceedings - 5th International Symposium on Quality Electronic Design, ISQUED 2004. IEEE Computer Society, p. 522-527 6 p. (Proceedings - 5th International Symposium on Quality Electronic Design, ISQUED 2004).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)
2003

Experimental study of EFO ward electrode wear, surface pollution, and discharge gaps in wire bonding process

Chung, K. J., Bernstein, J. B. & Yang, L., 2003 Mar 1, In : Tamkang Journal of Science and Engineering. 6, 1, p. 43-48 6 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2002

Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode

Luo, J., Chung, K. J., Hu, H. & Bernstein, J. B., 2002 Jan 1, 2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual. Institute of Electrical and Electronics Engineers Inc., Vol. 2002-January. p. 425-426 2 p. 996678

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode

Luo, J., Chung, K-J., Huang, H. & Bernstein, J. B., 2002 Jan 1, In : Annual Proceedings - Reliability Physics (Symposium). p. 425-426 2 p.

Research output: Contribution to journalConference article

6 Citations (Scopus)
2001

The impact of lead-free soldering on electronics packages

Yang, L., Bernstein, J. B. & Chung, K-J., 2001 Sep 1, In : Microelectronics International. 18, 3, p. 20-26 7 p.

Research output: Contribution to journalArticle

10 Citations (Scopus)