Kuan-Jung Chung

Associate Professor

  • 69 Citations
  • 5 h-Index
20012019
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Research Output 2001 2019

  • 69 Citations
  • 5 h-Index
  • 21 Conference contribution
  • 9 Article
  • 1 Conference article
2019

A novel disposable electrochemical sensor packaging with application for the detection of uric acid

Gan, Z. X., Chen, H. S., Lin, Y. C. & Chung, K-J., 2019 Jan 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 165-168 4 p. 8625822. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrochemical sensors
Packaging
Acids
Calibration
Measurement errors
Open Access
prognosis
Monte Carlo method
electric batteries
Monte Carlo methods
lithium
2018

Prognostic-based reliability assessment of a wafer handling robot arm using Wiener stochastic process model and Monte Carlo simulation

Huang, J. H., Cheng, H. M., Li, Y. R. & Chung, K. J., 2018 Jan 1, Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design. Pham, H. (ed.). International Society of Science and Applied Technologies, p. 1-5 5 p. (Proceedings - 24th ISSAT International Conference on Reliability and Quality in Design).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Random processes
Robots
Health
Position measurement
Charge coupled devices
2017

Estimating activation energy of the LiFePO4 battery using dual dynamic stress accelerated degradation tests

Lin, Y. C., Li, Y. R. & Chung, K-J., 2017 Jan 1, Conference Proceedings - 23rd ISSAT International Conference on Reliability and Quality in Design. Pham, H. (ed.). International Society of Science and Applied Technologies, p. 121-125 5 p. (Conference Proceedings - 23rd ISSAT International Conference on Reliability and Quality in Design).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Activation energy
Degradation
Electric vehicles
Temperature
Lithium-ion batteries

Predicting the degradation of li-ion battery using advanced machine learning techniques

Li, Y. R. & Chung, K. J., 2017 Jul 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 258-262 5 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2017-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mean square error
Learning systems
Degradation
Artificial intelligence
Lithium-ion batteries
2016
1 Citation (Scopus)

Predicting the lifetimes of LiFePO4 batteries on the basis of the gamma process through accelerated degradation measurements

Lin, Y. C. & Chung, K. J., 2016 Aug 12, 2016 IEEE International Conference on Prognostics and Health Management, ICPHM 2016. Institute of Electrical and Electronics Engineers Inc., 7542849

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gamma Process
Battery
Lifetime
Degradation
Electric vehicles
2015
1 Citation (Scopus)

Development of a leakage-free disposable package for biosensors immersed in the chemical solutions

Chung, K. J. & Wu, C. C., 2015 Feb 24, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 488-490 3 p. 7048439

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Biosensors
Gluing
Electrochemical impedance spectroscopy
Leakage (fluid)
Sensors
2 Citations (Scopus)

Lifetime prediction of the epoxy resin adhesive under the optical performance degradation process

Chen, C. Y., Wu, R. F., Huang, C. Y. & Chung, K. J., 2015 Dec 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 213-216 4 p. 7365251

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Epoxy Resins
Epoxy resins
Adhesives
Degradation
Brownian movement
2013
2 Citations (Scopus)

A novel double dynamic stress accelerated degradation test to evaluate power fade of batteries for electric vehicles

Lin, Y. C., Chung, K. J. & Hsiao, C. C., 2013 Aug 8, Intelligent Technologies and Engineering Systems. p. 161-168 8 p. (Lecture Notes in Electrical Engineering; vol. 234 LNEE).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric vehicles
Degradation
Temperature
Lithium
1 Citation (Scopus)

A patterning technique of lead zirconate titanate thin film by ultraviolet-light

Wu, C. C., Hsueh, C. H., Chang, Y. T., Chang, C. T. & Chung, K-J., 2013 Jun 1, In : Microsystem Technologies. 19, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

Photolysis
ultraviolet radiation
photolysis
Thin films
thin films
1 Citation (Scopus)

Design optimization of laser-induced microbridges for low resistance interline connections in ICs

Chung, K. J., Peckerar, M. & Bernstein, J. B., 2013 Mar, In : Microelectronic Engineering. 103, p. 70-75 6 p.

Research output: Contribution to journalArticle

design optimization
low resistance
Metals
Lasers
metals
1 Citation (Scopus)

Effect of strain rates on the mechanical behavior of Cu thin films of various thicknesses

Chung, K-J., Lin, C. F. & Chiang, W. C., 2013 Feb 20, Innovation for Applied Science and Technology. p. 94-97 4 p. (Applied Mechanics and Materials; vol. 284-287).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Strain rate
Thin films
Copper
Tensile testing
Polyimides
4 Citations (Scopus)

Mechanical behavior of copper thin films subjected to various strain rate loadings

Chung, K. J., Lin, C. F. & Chiang, W. C., 2013 Dec 1, In : Transactions of the Canadian Society for Mechanical Engineering. 37, 3, p. 861-871 11 p.

Research output: Contribution to journalArticle

Strain rate
Copper
Thin films
Tensile testing
Strain hardening
2012
8 Citations (Scopus)

Accelerated degradation assessment of 18650 lithium-ion batteries

Chung, K. J. & Hsiao, C. C., 2012 Jul 30, Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012. p. 930-933 4 p. 6228224. (Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Degradation
Aging of materials
Charging (batteries)
Temperature
Lithium
1 Citation (Scopus)

Linear energy control of laser drilling and its application in the repair of TFT-LCD bright pixels

Chen, T., Lin, M. T. & Chung, K. J., 2012 Nov 1, In : Microsystem Technologies. 18, 11, p. 1909-1915 7 p.

Research output: Contribution to journalArticle

laser drilling
Liquid crystal displays
Power control
Drilling
Repair
1 Citation (Scopus)

Reliability tests of a RFID-based lock for power meter applications

Chung, K-J., Jan, C. W., Chen, C. C. & Tsai, S. C., 2012 Jul 30, Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012. p. 945-948 4 p. 6228228. (Proceedings - 2012 International Symposium on Computer, Consumer and Control, IS3C 2012).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Radio frequency identification (RFID)
Seals
Thermal cycling
2011
1 Citation (Scopus)

The solder joint reliability assessment of a wafer level CSP package

Chung, K-J., Tseng, C. H. & Yang, L., 2011 Dec 1, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 370-372 3 p. 6117252. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Weibull distribution
Temperature
Metallurgy
Polyimides
2010
1 Citation (Scopus)

Experimental investigation of the optimal laser-induced microbridges

Chung, K. J. & Bernstein, J. B., 2010 Jul 1, In : Precision Engineering. 34, 3, p. 578-585 8 p.

Research output: Contribution to journalArticle

Scalability
Lasers
Acoustic impedance
Application specific integrated circuits
Processing
17 Citations (Scopus)

Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS

Tong, C. J., Cheng, Y. C., Lin, M. T., Chung, K. J., Hsu, J. S. & Wu, C. L., 2010 Jul 1, In : Microsystem Technologies. 16, 7, p. 1131-1137 7 p.

Research output: Contribution to journalArticle

paddles
Mechanical testing
microelectromechanical systems
MEMS
deflection
4 Citations (Scopus)

The investigation of modified norris-landzberg acceleration models for reliability assessment of ball grid array packages

Chung, K. J., Yang, L., Wang, B. Y. & Wu, C. C., 2010 Dec 1, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699640. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ball grid arrays
Soldering alloys
Temperature
2009
1 Citation (Scopus)

Measure the mechanical behavior of thin films using four step phase-shifting methods on the novel paddle cantilever beam

Lin, M. T., Tong, C. J., Cheng, Y. C., Chung, K. J. & Hsu, J. S., 2009 Dec 1, Society for Experimental Mechanics - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2009. p. 2387-2393 7 p. (Society for Experimental Mechanics - SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2009; vol. 4).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cantilever beams
Thin films
Deflection (structures)
Clean rooms
Stress measurement

Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method

Lin, M. T., Tong, C. J., Cheng, Y. C., Chung, K-J. & Hsu, J. S., 2009 Sep 23, 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009. p. 140-144 5 p. 4919482. (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Interferometers
Residual stresses
Thin films
Mechanical properties
Silver
2006

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K-J., Bernstein, J. B., Luo, J. I., Tuchman, J. A. & Ma, Z. K., 2006 Jan 1, Conference on Lasers and Electro-Optics, CLEO 2006. Optical Society of America, (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

low resistance
Pulsed lasers
pulsed lasers
2005

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K. J., Bernstein, J. B., Luo, J., Tuchman, J. A. & Ma, Z. K., 2005 Jan 1, Quantum Electronics and Laser Science Conference, QELS 2005. Optical Society of America, (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

low resistance
Pulsed lasers
pulsed lasers

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K. J., Bernstein, J. B., Luo, J. I., Tuchman, J. A. & Ma, Z. K., 2005 Oct 31, 2005 Quantum Electronics and Laser Science Conference (QELS). p. 1564-1566 3 p. (Quantum Electronics and Laser Science Conference (QELS); vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pulsed lasers

Experimental study for low resistance interline connections using pulsed laser techniques

Chung, K-J., Bernstein, J. B., Luo, J. I., Tuchman, J. A. & Ma, Z. K., 2005 Jan 1, Conference on Lasers and Electro-Optics, CLEO 2005. Optical Society of America, (Optics InfoBase Conference Papers).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

low resistance
Pulsed lasers
pulsed lasers
2004
5 Citations (Scopus)

A high performance radiation-hard field programmable analog array

Luo, J., Bernstein, J. B., Tuchman, J. A., Huang, H., Chung, K-J. & Wilson, A. L., 2004 Jan 1, Proceedings - 5th International Symposium on Quality Electronic Design, ISQUED 2004. IEEE Computer Society, p. 522-527 6 p. (Proceedings - 5th International Symposium on Quality Electronic Design, ISQUED 2004).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Radiation
Lasers
Networks (circuits)
Noise figure
Rapid prototyping
2003
1 Citation (Scopus)

Experimental study of EFO ward electrode wear, surface pollution, and discharge gaps in wire bonding process

Chung, K. J., Bernstein, J. B. & Yang, L., 2003 Mar 1, In : Tamkang Journal of Science and Engineering. 6, 1, p. 43-48 6 p.

Research output: Contribution to journalArticle

Pollution
Wear of materials
Wire
Electrodes
Cleaning
2002
6 Citations (Scopus)

Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode

Luo, J., Chung, K-J., Huang, H. & Bernstein, J. B., 2002 Jan 1, In : Annual Proceedings - Reliability Physics (Symposium). p. 425-426 2 p.

Research output: Contribution to journalConference article

Silicon carbide
Diodes
Electric breakdown
Temperature
Phonon scattering

Temperature dependence of Ron,sp in silicon carbide and GaAs Schottky diode

Luo, J., Chung, K. J., Hu, H. & Bernstein, J. B., 2002 Jan 1, 2002 IEEE International Reliability Physics Symposium Proceedings, IRPS 2002 - 40th Annual. Institute of Electrical and Electronics Engineers Inc., Vol. 2002-January. p. 425-426 2 p. 996678

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silicon carbide
Diodes
Electric breakdown
Temperature
Phonon scattering
2001
10 Citations (Scopus)

The impact of lead-free soldering on electronics packages

Yang, L., Bernstein, J. B. & Chung, K-J., 2001 Sep 1, In : Microelectronics International. 18, 3, p. 20-26 7 p.

Research output: Contribution to journalArticle

soldering
Soldering
Electronic equipment
Lead
electronics