• 115 Citations
  • 6 h-Index
20032019
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Fingerprint Dive into the research topics where Kerwin Wang is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Self assembly Engineering & Materials Science
Electrostatic actuators Engineering & Materials Science
Display devices Engineering & Materials Science
Actuators Engineering & Materials Science
Electrostatics Engineering & Materials Science
assembly Physics & Astronomy
Substrates Engineering & Materials Science
Capacitive sensors Engineering & Materials Science

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Research Output 2003 2019

  • 115 Citations
  • 6 h-Index
  • 33 Conference contribution
  • 3 Article
  • 1 Paper
  • 1 Conference article

Dip-drawing process characterization of making high-aspect-ratio polymeric microneedles

Yang, C. C. & Wang, K., 2019 Jan 16, Proceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018. Meen, T-H. (ed.). Institute of Electrical and Electronics Engineers Inc., p. 105-108 4 p. 8614952. (Proceedings of the 2018 IEEE International Conference on Advanced Manufacturing, ICAM 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Curing
Aspect ratio
dip
Spin coating
mathematics

A smart sensor node design for efficient communication in ZigBee wireless sensor networks

Lin, P. H. & Wang, K., 2018 Oct 1, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. Lam, A. D. K-T., Prior, S. D. & Meen, T-H. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 366-369 4 p. 8478939. (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Smart sensors
Zigbee
Sensor nodes
Wireless sensor networks
Communication

Experimental investigation of micro-aerial vehicle wing designs

Hsu, A. Y. & Wang, K., 2018 Oct 1, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. Lam, A. D. K-T., Prior, S. D. & Meen, T-H. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 385-388 4 p. 8479173

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Antennas
Aerodynamics
Angle of attack
Airfoils
Drag

Glass ball grid array arrangement and characterization for capacitive proximity sensor

Chu, C. Y. & Wang, K., 2018 Oct 1, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. Lam, A. D. K-T., Prior, S. D. & Meen, T-H. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 498-501 4 p. 8478878. (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Proximity sensors
Capacitive sensors
Ball grid arrays
Capacitance
Glass

UV-curable 3D printed fresnel-like scalloped optical structure for oil degradation monitoring

Wang, J. G. & Wang, K., 2018 Oct 1, Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017. Lam, A. D. K-T., Prior, S. D. & Meen, T-H. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 502-505 4 p. 8479217. (Proceedings of the 2017 IEEE International Conference on Information, Communication and Engineering: Information and Innovation for Modern Technology, ICICE 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3D printers
Degradation
Monitoring
Optical sensors
Optical devices