• 252 Citations
  • 9 h-Index
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Fingerprint Dive into the research topics where Dyi-Cheng Chen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Finite element method Engineering & Materials Science
Bicycles Engineering & Materials Science
Taguchi methods Engineering & Materials Science
Plastic deformation Engineering & Materials Science
Extrusion Engineering & Materials Science
Plastics Engineering & Materials Science
Aluminum alloys Engineering & Materials Science
Forging Engineering & Materials Science

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Research Output 1999 2019

  • 252 Citations
  • 9 h-Index
  • 50 Article
  • 30 Conference contribution
  • 10 Conference article
  • 2 Paper

A Study Regarding the Gap between the Industry and Academia Expectations for College Student's Employability

Sui, F. M., Chang, J. C., Hsiao, H. C., Chen, S. C. & Chen, D-C., 2019 Jan 9, 2018 IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2018. IEEE Computer Society, p. 1573-1577 5 p. 8607269. (IEEE International Conference on Industrial Engineering and Engineering Management; vol. 2019-December).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Word processing
Application programs

Development of assessment indicators for measuring the student learning effects of artificial intelligence-based robot design

Shyr, W-J., Yang, F. C., Liu, P. W., Hsieh, Y. M., You, C. S. & Chen, D-C., 2019 Jul 1, In : Computer Applications in Engineering Education. 27, 4, p. 863-868 6 p.

Research output: Contribution to journalArticle

learning success
artificial intelligence
Artificial intelligence

Finite element analysis of deep drawing

Chen, D. C., Cheng-Yu, L. & Lai, Y. Y., 2019 Jan 1, In : Advances in Mechanical Engineering. 11, 9

Research output: Contribution to journalArticle

Open Access
Deep drawing
Aluminum alloys
Plastic flow
Finite element method
Plastic deformation
1 Citation (Scopus)

Investigation on fracture and conductivity of flex-on-film flexible bonding using anisotropic conductive film considering repeated bending

Lin, C. M., Chen, D-C. & Liu, Y. C., 2019 Aug 1, In : Microsystem Technologies. 25, 8, p. 3017-3026 10 p.

Research output: Contribution to journalArticle

Conductive films
Acoustic impedance
electrical resistance

Investigation on Optimization of Baking in Sole Bonding Process

Chen, D. C., Jin, H. W. & Su, J. Z., 2019 Oct 24, In : IOP Conference Series: Materials Science and Engineering. 644, 1, 012002.

Research output: Contribution to journalConference article

Open Access
Computer aided engineering